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圆片厚度规则

Wafer Thickness Rule

圆片厚度如不在气派规格内必须将圆片减薄

Back grinding is required if the thickness exceeds CPC spec.


产品种类 

Product Kind 

封装形式PKG. Type 

圆片厚度Wafer thickness

DIP/HDIP

DIP7/8/10/14/16/18/20

10~16.8 mil (250~420 um)

HDIP12

Qipai

Qipai8/16

10~12.6 mil (250~350 um)

 SOP8

SOP7/8/14/16

10~12.6 mil (250~350 um)

SOP20/24/28

0.635 SSOP20/24

0.65 SSOP16/20/24/28

1.0 SSOP24

HSOP

HSOP28

10~12.6 mil (250~350 um)

ESOP

ESOP8/16

7~11 mil (180~280 um)

MSOP/EMSOP

MSOP8/10

EMSOP8/10

TSSOP

TSSOP8

7~8.6 mil (180~220 um)

SOT

SOT23(Small)

6.7~8.3 mil (170~210 um)

SOT23-3/5/6

SOT223

9.5~13.4mil (240~340 um)

SOT89-3/5

LQFP

LQFP32/48/64

8~10 mil (200~250 um)

TSOT

TSOT23-3/5/6

5~7 mil (130~180um)

QFN/DFN

QFN3X3/4X4/5X5/6X6/7X7

7~8.6 mil (180~220 um)

DFN2X2/2X3/3X3/4X4/5X5

5~7 mil (130~180um)

DFN1006-2/3

TO

TO252

11~13.4 mil (280~340 um)

CPC

CPC4/5/8/14/16/20/24

6.7~8.3 mil (170~210 um)

ECPC

ECPC14/16/20/24

6.7~8.3 mil (170~210 um)



 



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